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HomeMaterials Science ForumMaterials Science Forum Vols. 196-201Measurements of Polishing-Induced Residual Damages...

Measurements of Polishing-Induced Residual Damages in Silicon Wafers Using Noncontact Photoconductivity Amplitude Technique

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Defects in Semiconductors 18

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Periodical:

Materials Science Forum (Volumes 196-201)

Pages:

1813-1816

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.196-201.1813

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Online since:

November 1995

Authors:

Y. Ogita, M. Nakano, H. Masumura

Keywords:

mm-Wave, Photoconductivity Amplitude, Polishing Damage, Slicing Damage, UV Laser

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© 1995 Trans Tech Publications Ltd. All Rights Reserved

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