Subsurface Damage in Single Diamond Tool Machined SI Wafers

Abstract:

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Periodical:

Materials Science Forum (Volumes 196-201)

Edited by:

M. Suezawa and H. Katayama-Yoshida

Pages:

1841-1846

DOI:

10.4028/www.scientific.net/MSF.196-201.1841

Citation:

T. Mchedlidze et al., "Subsurface Damage in Single Diamond Tool Machined SI Wafers", Materials Science Forum, Vols. 196-201, pp. 1841-1846, 1995

Online since:

November 1995

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Price:

$35.00

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