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HomeMaterials Science ForumMaterials Science Forum Vols. 196-201Direct Bonding of Silicon Wafers with Grooved...

Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

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Defects in Semiconductors 18

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Periodical:

Materials Science Forum (Volumes 196-201)

Pages:

1853-1858

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.196-201.1853

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Online since:

November 1995

Authors:

Igor V. Grekhov, T.S. Argunova, Mikhail Yu. Gutkin, L.S. Kostina, T.V. Kudryavtzeva

Keywords:

Grooved Surfaces, Silicon Direct Bonding, Structural Defects

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© 1995 Trans Tech Publications Ltd. All Rights Reserved

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