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HomeMaterials Science ForumMaterials Science Forum Vols. 258-263Mechanism of Ultrasonic Enhanced Hydrogenation in...

Mechanism of Ultrasonic Enhanced Hydrogenation in Poly-Si Thin Films

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Defects in Semiconductors 19

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Periodical:

Materials Science Forum (Volumes 258-263)

Pages:

197-202

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.258-263.197

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Online since:

December 1997

Authors:

Sergei S. Ostapenko

Keywords:

Dangling Bond, Hydrogenation, Luminescence, Ultrasound Treatment

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© 1997 Trans Tech Publications Ltd. All Rights Reserved

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