Paper Titles

Optimized Amorphous Silicon Based Two-Terminal Thin Film Detectors for Color Recognition
p.221

Material-Selective Planarization of Oxide Layers: A Novel Technology
p.227

Depth Profiling of Thin TiSi_x-Films on Silicon Carbide by SNMS
p.231

Flowfill-Process as a New Concept for Inter-Metal-Dielectrics
p.235

Copper Metallization of Submicron Trenches with Pulsed Vacuum Arc
p.239

High Resolution TEM Investigations of Nanostructures in Hard Amorphous Carbon Films
p.243

Properties of Si₃N₄-Layers Deposited by Medium Frequency Twin Magnetron Sputtering
p.247

On the Initial Cubic Phase Nucleation in Boron Nitride Films
p.251

Structure, Composition and Residual Stresses of Magnesium Fluoride Thin Films Deposited by Direct Evaporation
p.255

HomeMaterials Science ForumMaterials Science Forum Vols. 287-288Copper Metallization of Submicron Trenches with...

Copper Metallization of Submicron Trenches with Pulsed Vacuum Arc

Article Preview

Abstract:

You might also be interested in these eBooks

Trends and New Applications of Thin Films

Info:

Periodical:

Materials Science Forum (Volumes 287-288)

Pages:

239-242

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.287-288.239

Citation:

Cite this paper

Online since:

August 1998

Authors:

P. Siemroth, P. Wenzel, Th. Witke, Bernd Schultrich

Keywords:

Metallization, Pulsed Vacuum Arc, Submicron Trenches

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1998 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: