Paper Titles

Round Robin Test on the Determination of Residual Stress Depth Distributions by X-ray Diffraction
p.659

Behavior of Metallic Samples Subjected to External Stresses during Heating-Cooling Cycles
p.665

Yield Strength Determination of TiN Film by In-Situ XRD Stress Analysis Method
p.671

X-Ray Stress Measurements of TiCN Thin Films
p.677

Residual Stresses in Decorative Electroplated Coatings
p.683

Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects
p.691

Evaluation of Growth and Thermal Strains/Stresses in Epitaxial Thin Films Using X-Ray Diffraction
p.697

X-Ray Measurements of TiN Film and Steel Substrate Subjected to External Loading
p.703

Macro Stress Mapping on Thin Film Buckling
p.709

HomeMaterials Science ForumMaterials Science Forum Vols. 404-407Residual Stresses in Decorative Electroplated...

Residual Stresses in Decorative Electroplated Coatings

Article Preview

Abstract:

You might also be interested in these eBooks

Residual Stresses VI, ECRS6

Info:

Periodical:

Materials Science Forum (Volumes 404-407)

Pages:

683-690

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.404-407.683

Citation:

Cite this paper

Online since:

August 2002

Authors:

J.C.P. Pina, A. Morão Dias, Jean Lu Lebrun

Keywords:

Decorative Coatings, Electroplate Nickel, Electroplating, Non-Nickel Coatings, Residual Stress

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2002 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: