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HomeMaterials Science ForumMaterials Science Forum Vols. 404-407Changes in Stress and Microstructure in Sputter...

Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects

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Abstract:

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Residual Stresses VI, ECRS6

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Periodical:

Materials Science Forum (Volumes 404-407)

Pages:

691-696

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.404-407.691

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Online since:

August 2002

Authors:

B. Okolo, P. Lamparter, U. Welzel, T. Wagner, Eric Jan Mittemeijer

Keywords:

Coalescence, Cu Films, Microstructure, Stress, Substrate Surface Roughness

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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