Application of the White/Monochromatic X-Ray μ-Diffraction Technique to the Study of Texture and Triaxial Strain at the Submicron Level

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A scanning X-ray microdiffraction beamline using white or monochromatic beam has been recently made available to the user’s community at the Advanced Light Source, Berkeley, USA. Samples are scanned under an X-ray beam with size ranging from 15 microns down to less than a micron, and 2D diffraction patterns are collected at each step. A specifically written software allows for the full treatments of these patterns to obtain as outputs high spatial resolution grain orientation, strain/stress or mineral species distribution maps. The range of applications of this technique goes from the study of the mechanical properties of thin films to the understanding of trace elements speciation in environmental sciences.

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Periodical:

Materials Science Forum (Volumes 490-491)

Edited by:

Sabine Denis, Takao Hanabusa, Bob Baoping He, Eric Mittemeijer, JunMa Nan, Ismail Cevdet Noyan, Berthold Scholtes, Keisuke Tanaka, KeWei Xu

Pages:

672-677

Citation:

P. Goudeau et al., "Application of the White/Monochromatic X-Ray μ-Diffraction Technique to the Study of Texture and Triaxial Strain at the Submicron Level", Materials Science Forum, Vols. 490-491, pp. 672-677, 2005

Online since:

July 2005

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$38.00

[1] C. Riekel: Rep. Prog. Phys. Vol. 63 (2000), p.262.

[2] A.A. MacDowell, R.S. Celestre, N. Tamura, R. Spolenak, B.C. Valek, W.L. Brown, J.C. Bravman, H.A. Padmore, B.W. Batterman and J.R. Patel: Nucl. Instrum. Methods Phys. Res. A Vol. 467-468 (2001), p.936.

DOI: https://doi.org/10.1016/s0168-9002(01)00530-7

[3] J. -S. Chung and G. E Ice.: J. Appl. Phys. Vol. 86 (1999), p.5249.

[4] J. S. Chung, N. Tamura, G. E. Ice, B. C. Larson, J. D. Budai, W. Lowe : Mater. Res. Soc. Proc. Vol. 563 (1999), p.169.

[5] N. Tamura, J. -S. Chung, G. E. Ice, B. C. Larson, J. D. Budai, J. Z. Tischler, M. Yoon, E. L. Williams, W. P. Lowe: Mater. Res. Soc. Proc. Vol. 563 (1999) p.175.

[6] N. Tamura, A.A. MacDowell, R.S. Celestre, H.A. Padmore, B.C. Valek, J.C. Bravman, R. Spolenak, W.L. Brown, T. Marieb, H. Fujimoto, B.W. Batterman and J.R. Patel: Appl. Phys. Lett. Vol. 80 (2002), p.3724.

DOI: https://doi.org/10.1063/1.1477621

[7] I.C. Noyan and J.B. Cohen: Residual Stress Measurement by Diffraction and Interpretation (Springer, New York, 1987).

[8] V. Hauk: Structural and residual stress analysis by non destructive methods: evaluation, application, assessment (Elsevier, Netherlands 1997).

[9] Ph. Goudeau, P. Villain, N. Tamura, H.A. Padmore: Appl. Phys. Lett. Vol. 83 (2003), p.51.

[10] R. Spolenak, W. L. Brown, N. Tamura, A. A. MacDowell, R. S. Celestre, H. A. Padmore, B. Valek, J. C. Bravman, T. Marieb, H. Fujimoto, B. W. Batterman, J. R. Patel: Physical Review Letters Vol. 90 (2003), p.096102.

DOI: https://doi.org/10.1103/physrevlett.90.096102

[11] N. Tamura, A.A. MacDowell, R. Spolenak, B.C. Valek, J.C. Bravman, W.L. Brown, R.S. Celestre, H.A. Padmore, B.W. Batterman and J.R. Patel: J. Synchrotron Rad. Vol. 10 (2003) p.137.

DOI: https://doi.org/10.1107/s0909049502021362

[12] N. Tamura, R.S. Celestre, A.A. MacDowell, H.A. Padmore, R. Spolenak, B.C. Valek, N. Meier Chang, A. Manceau and J.R. Patel: Rev. of Scientific Instrum. Vol. 73 (2002), p.1369.

DOI: https://doi.org/10.1063/1.1436539

[13] G. E Ice,. J. -S. Chung, J. Z. Tischler, A. Lunt, L. Assoufid: Rev. Sci Inst. Vol. 71 (2001), p.2635.

[14] B. C. Larson, Wenge Yang, G. E. Ice, J. D. Budai, J. Z. Tischler: Nature Vol. 415 (2002) p.887.