A Step Toward High Temperature Intelligent Power Modules Using 1.5kV SiC-BJT

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Looking back to the development of inverters using SiC switches, it appears that SiC devices do not behave like their silicon counterparts. Their ability to operate at high temperature makes them attractive. Developing drivers suitable for 200 °C operation is not straightforward. In a perspective of high integration and large power density, it is wise to consider a monolithic integration of the driver parts for the sake of reliability. Silicon is not suitable for high ambient temperature; silicon-oninsulator offers better performances and presents industrial perspectives. The paper focuses on a SiC BJT driver: it processes logical orders from outside, drives adequately the BJT to turn it either on or off, monitors the turn-off and turn-on state of the device, and acts accordingly to prevent failure. SiC BJT imposes specific performances different from the well known ones of SiC JFET or MOSFET. The paper addresses a preliminary analysis of a SOI driver, anticipating the behavior of SiC-BJT and the change in behavior at high temperature. A discret driver has been designed and fabricated. Elementary functional blocks have been validated, and a BJT converter successfully operated at high temperature with high efficiency ( = 88%).

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Periodical:

Materials Science Forum (Volumes 645-648)

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1155-1158

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April 2010

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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[1] M.A. Vijayaraghavan et. al., PESC 2007, Vol. 17-21 (2007), pp.1491-1495.

Google Scholar

[2] D. M. Brown et. al., Trans. 2nd. Int. High Temperature Electronics Conf. (Charlotte, NC) XI-17-22 (1994).

Google Scholar

[3] L.C. Yu, et. al., ISDRS 2007, Vol. 12-14 (2007), p.1.

Google Scholar

[4] K. Sheng, et. al., ISDRS 2005, Vol. 7-9 (2005), p.168.

Google Scholar

[5] B. Ray, et. al., In Proc. APEC (2007), p.998.

Google Scholar

[6] Xu Xiaojun, et. al. In Proc. APEC (2007), p.1268.

Google Scholar