Non-Polar SiC Crystal Growth with m-Plane(1-100) and a-Plane(11-20) by PVT Method

Abstract:

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The present research was focused to produce 2 inch wafers from small rectangular seeds and to investigate the quality of non-polar SiC substrates grown by a conventional PVT method. The non-polar SiC seeds were prepared by cutting along <0001> direction of 6H-SiC crystal grown on (0001) basal plane. As SiC ingot grows, many defects in connected region were gradually diminished. While the full width at half maximum (FWHM) values of m-plane SiC substrate measured along a-direction and c-direction were 60 arcsec and 70 arcsec, respectively, and the FWHM values of a-plane SiC substrate measured along m-direction and c-direction were 27 arcsec and 31 arcsec respectively. The stacking faults lying in the basal plane can be detected by molten KOH etching as linear etch pits extending along <0001> on the (11-20) surface and the carrier concentration was observed by Raman spectrum.

Info:

Periodical:

Materials Science Forum (Volumes 645-648)

Edited by:

Anton J. Bauer, Peter Friedrichs, Michael Krieger, Gerhard Pensl, Roland Rupp and Thomas Seyller

Pages:

37-40

DOI:

10.4028/www.scientific.net/MSF.645-648.37

Citation:

I. G. Yeo et al., "Non-Polar SiC Crystal Growth with m-Plane(1-100) and a-Plane(11-20) by PVT Method", Materials Science Forum, Vols. 645-648, pp. 37-40, 2010

Online since:

April 2010

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$35.00

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