Consequences of NO Thermal Treatments in the Properties of Dielectric Films / SiC Structures

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Abstract:

The consequences of thermal treatments in nitric oxide atmospheres on the characteristics of dielectric films / SiC structures was investigated by high-frequency capacitance-voltage measurements, X-ray photoelectron spectroscopy, and X-ray reflectometry techniques. It was observed that nitrogen incorporation in dielectric films / SiC structures leads to the formation of a thinner interfacial layer that contains carbon. This fact was related to the improvement of electrical properties of those structures.

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Materials Science Forum (Volumes 645-648)

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689-692

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April 2010

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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