Electrical Activation of B+-Ions Implanted into 4H-SiC

Article Preview

Abstract:

Boron (B) ions were implanted into 4H-SiC. In order to avoid the out-diffusion of B ions during the subsequent annealing process, two processing techniques were applied. Either a box-shaped B-profile was implanted, which was followed by a two-step annealing (900°C for 120 min + annealing temperature TA for 30 min), or a box-shaped B-profile was implanted together with two carbon (C) Gaussian profiles located on both edges of the B box-profile followed by a one-step annealing (TA for 30 min). The annealing temperature TA ranged from 1500°C to 1750°C. The electrically activated B acceptor concentration was measured by temperature-dependent Hall effect and the energy for the formation of the B acceptor was determined assuming a first order process.

You might also be interested in these eBooks

Info:

Periodical:

Materials Science Forum (Volumes 645-648)

Pages:

697-700

Citation:

Online since:

April 2010

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2010 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] T. Troffer, M. Schadt, T. Frank, H. Itoh, G. Pensl, J. Heindl, H. Strunk and M. Maier: phys. stat. sol. (a), Vol. 162 (1977), p.277.

DOI: 10.1002/1521-396x(199707)162:1<277::aid-pssa277>3.0.co;2-c

Google Scholar

[2] M. Laube, G. Pensl: Mater. Sci. Forum Vol. 338-342 (2000), p.941.

Google Scholar

[3] H. Bracht, N. A. Stolwijk, M. Laube, G. Pensl: Appl. Phys. Lett. Vol. 77 (2002), p.3188.

Google Scholar

[4] P. A. Stolk, H. J. Gossmann, D. J. Esglesham, D. C. Jacobson, C. S. Rafferty, H. S. Luftman, T. E. Haynes: J. Appl. Phys. Vol. 81 (1997), p.6031.

Google Scholar

[5] M. Laube, G. Pensl and H. Itoh: Appl. Phys. Lett. Vol. 74 (1999), p.2292.

Google Scholar

[6] F. Schmid, M. Krieger, M. Laube, G. Pensl and G. Wagner: Silicon Carbide - Recent Major Advances, Springer, Berlin, 2003, p.517, Eds. W.J. Choyke, H. Matsunami, G. Pensl.

DOI: 10.1007/978-3-642-18870-1

Google Scholar

[7] J.S. Blakemore: Semiconductor Statistics, Dover Publications Inc., New York, 1987, p.117.

Google Scholar

[8] H. Ryssel, I. Ruge: Ionenimplantation, B.G. Teubner, Stuttgart, 1978, p.57.

Google Scholar

[9] M. Oberndorfer, M. Krieger, F. Schmid, H.B. Weber, G. Pensl, A. Schöner: Mater. Sci. Forum Vol. 343-346 (2007), p.343.

Google Scholar