Investigation of Pressure Dependent Thermal Contact Resistance between Silver Metallized SiC Chip and DBC Substrate

Zsolt Toth Pal; Ya Fan Zhang; Ilja Belov; Hans Peter Nee; Mietek Bakowski

doi:10.4028/www.scientific.net/MSF.821-823.452

Paper Titles

Electrical Characterization of Ni-Silicide Schottky Contacts on SiC for High Performance Temperature Sensor
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Sputtered Ohmic Cobalt Silicide Contacts to 4H-SiC
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Investigation of Ti/Ni Bilayer Contacts to n-Type 4H-SiC
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Extremely Enhanced Diffusion of Nitrogen in 4H-SiC Observed in Liquid-Nitrogen Immersion Irradiation of Excimer Laser
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Investigation of Pressure Dependent Thermal Contact Resistance between Silver Metallized SiC Chip and DBC Substrate
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Influence of Conduction-Type on Thermal Oxidation Rate in SiC(0001) with Various Doping Densities
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Characterization of Inhomogeneity in SiO₂ Films on 4H-SiC Epitaxial Substrate by a Combination of Fourier Transform Infrared Spectroscopy and Cathodoluminescence Spectroscopy
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Fabrication of 3C-SiC MOS Capacitors Using High-Temperature Oxidation
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Direct Observation of Dielectric Breakdown at Step-Bunching on 4H-SiC
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HomeMaterials Science ForumMaterials Science Forum Vols. 821-823Investigation of Pressure Dependent Thermal...

Investigation of Pressure Dependent Thermal Contact Resistance between Silver Metallized SiC Chip and DBC Substrate

Abstract:

– Thermal contact resistances between a silver metallized SiC chip and a direct bonded copper (DBC) substrate have been measured in a heat transfer experiment. A novel experimental method to separate thermal contact resistances in multilayer heat transfer path has been demonstrated. The experimental results have been compared with analytical calculations and also with 3D computational fluid dynamics (CFD) simulation results. A simplified CFD model of the experimental setup has been validated. The results show significant pressure dependence of the thermal contact resistance but also a pressure independent part.

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Materials Science Forum (Volumes 821-823)

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452-455

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.821-823.452

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Online since:

June 2015

Authors:

Zsolt Toth Pal*, Ya Fan Zhang, Ilja Belov, Hans Peter Nee, Mietek Bakowski

Keywords:

DBC Substrate, Heat Transfer, Pressure Dependence, Thermal Resistance

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