Microstructure and Texture Evolution in Nickel during Accumulative Roll Bonding

Jia Qi Duan; Md Zakaria Quadir; Michael Ferry

doi:10.4028/www.scientific.net/MSF.879.454

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HomeMaterials Science ForumMaterials Science Forum Vol. 879Microstructure and Texture Evolution in Nickel...

Microstructure and Texture Evolution in Nickel during Accumulative Roll Bonding

Abstract:

Microstructure and texture evolution of commercially pure Ni processed by accumulative roll-bonding (ARB) up to eight cycles were studied using electron back scattered diffraction (EBSD). During ARB processing, the original coarse equiaxed grains were gradually transformed into refined lamellar grains along the rolling direction (RD). Shear bands started forming after three cycles. The fraction of low angle grain boundaries (LAGBs) increased after the first and second cycle because of orientation spreading within the original grains. However, their fraction decreased with the evolution of high angle grain boundaries (HAGBs) during subsequent deformations, until saturation was reached after six cycles. Overall, the typical deformation texture components (S, Copper and Brass) were enhanced up to six ARB cycles and then only Copper was further strengthened. At higher cycles a higher Copper concentration was found near sample surface than the interiors due to a high frictional shear of ARB processing.

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Materials Science Forum (Volume 879)

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454-458

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https://doi.org/10.4028/www.scientific.net/MSF.879.454

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Online since:

November 2016

Authors:

Jia Qi Duan, Md Zakaria Quadir, Michael Ferry*

Keywords:

Accumulative Roll Bonding (ARB), Microstructure, Nickel, Texture

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