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Salicide-Like Process for the Formation of Gate and Source Contacts in 4H-SiC TSI-VJFETs
Abstract:
The self-aligned approach allowed to fabricate 4H-SiC VJFETs with conventional contact lithography with only 4 lithography steps. The main problem of this approach was the gate-source leakage current. In order to address this issue, a salicide process has been adopted resulting in a substantial reduction of the gate-source leakage current. The success of this approach paved the way for fabricating high power 4H-SiC devices with extremely low fabrication cost.
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Pages:
407-410
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Online since:
May 2017
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© 2017 Trans Tech Publications Ltd. All Rights Reserved
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