Dependency of 1/f Noise on Initial Oxidation Method in Nano-CMOS Technology

Article Preview

Abstract:

In this paper, it is presented that flicker (1/f) noise of ultra thin gate oxide can be improved by initial oxidation and subsequent plasma nitridation(PN). PN which raises Nitrogen peak upward from the Si/Oxide interface to gate polysilicon/Oxide interface is adopted mainly to improve the life time such as Negative-Bias Temperature Instability (NBTI) and hot carrier in Nano CMOS technology. Three different types of initial oxidation prior to plasma nitridation are investigated. One is slow thermally grown oxide(STO) in very small Oxygen ambient, another is rapid thermally grown oxide(RTO) and the other is grown in Nitrous oxygen ambient (NO). Oxide thickness of all splits is about 14.5< Then, it is shown that STO has the lowest drain current noise power (Sid) among the splits. The interface trap densitie (Dit) of each oxide is characterized using charge pumping method. Finally, we reached a conclusion that the 1/f noise can be significantly reduced by initial STO and Plasma Nitridation in Nano CMOS technology.

You might also be interested in these eBooks

Info:

Periodical:

Solid State Phenomena (Volumes 121-123)

Pages:

595-598

Citation:

Online since:

March 2007

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] K.F. Schuegraf and C. Hy, : IEEE Trans. Electron Devices, vol. 41. (1994), pp.761-767.

Google Scholar

[2] K.F. Schuegraf and C. Hy, : Semicond. Sci. Technol, vol. 9. (1994), pp.989-1004.

Google Scholar

[3] B. Neri, P. Olivo, R. Slaetti, and M. Signoretta : Microelecton. Reliab. vol. 35, no. 3 (1995), pp.529-537.

Google Scholar

[4] J. Lee , G. Bosman , K. R. Green, : IEEE Trans. Electron Devices, vol. 49. (2002), pp.1232-1241.

Google Scholar

[5] S.H. Park, Y.G. Kim, H.H. Ji, H.D. Lee, J.S. Kim, S.H. Baek, J.H. Lee, K.C. Kim, B.S. Song, H.K. Bae, M.O. Kim, H.S. Lee, Y.S. Kang and D.B. Kim, Jpn. J. Appl. Phys., Vol. 14. (2004) pp.1709-1712.

DOI: 10.1143/jjap.43.1709

Google Scholar

[6] T. Ohguro , Y. Okayma , K. Matsuzawa , K. Matsunaga , N. Aoki , K. Kojima , H.S. Momose and K. Ishimaru : Sym on VLSI Technology Digest of Technical papers 4A -1 p.37.

DOI: 10.1109/vlsit.2003.1221074

Google Scholar