Acknowledgements
Etching of Silicon Dioxide with Gas Phase HF and Water: Initiation, Bulk Etching, and Termination.
p.3
p.3
Evaluation of the Plasmaless Gaseous Etching Process
p.7
p.7
Single Wafer Hydrophobic Surface Preparation on 300mm by HF Vapor
p.11
p.11
Insights into HF-Last Processes and Particle Performance in a Single Wafer Spin Cleaning Tool
p.15
p.15
Implementing an In Situ Surface Preparation Prior to Ni Deposition for Ni Salicide Processes
p.19
p.19
Electrical Impact of Various Arsenic-Residues Cleanings
p.23
p.23
Elimination of Watermark on Extremely High-Doped Poly-Silicon Surfaces Using HF-Vapor Cleaning
p.27
p.27
Passivation Studies of Germanium Surfaces
p.33
p.33
Acknowledgements
Abstract:
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Periodical:
Solid State Phenomena (Volume 134)
Online since:
November 2007
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© 2008 Trans Tech Publications Ltd. All Rights Reserved
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