Paper Titles

Impact of Re-Gasified Water on Megasonic Cleaning
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The Removal of Silica Particles from Micron Wide Trenches by Megasonic Cleaning
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Is there Gas Entrapped on Submerged Silicon Wafers? Visualizing Nano-Scale Bubbles with Cavitation
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Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal
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Study of the Dynamics of Local Particle Removal Efficiencies Using Localized Haze Maps
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Effect of Ozone Supply Methods on PRE in Alkaline Ozone Solutions
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Challenges of Single-Wafer Wet Cleaning for Low Temperature Pre-Epitaxial Treatment of SiGe
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Estimation of Detrimental Impact of New Metal Candidates in Advanced Microelectronics
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Plastic Containers Contamination by Volatile Acids : Accumulation, Release and Transfer to Cu-Surfaces during Wafers Storage
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HomeSolid State PhenomenaSolid State Phenomena Vol. 134Study of the Dynamics of Local Particle Removal...

Study of the Dynamics of Local Particle Removal Efficiencies Using Localized Haze Maps

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Abstract:

The local particle removal efficiency (PRE) of nano particles in megasonic cleaning experiments is studied. This approach makes it possible to quantify non uniform cleaning effects over the wafer and to look into the dynamics of particle removal at different areas on the wafer. A direct correlation between PRE and megasonic induced damage of device structures demonstrates that a considerable amount of damage is already formed at less efficiently cleaned areas of the wafer.

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

233-236

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.233

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Online since:

November 2007

Authors:

Tom Janssens, Frank Holsteyns, Karine Kenis, Sophia Arnauts, Twan Bearda, Kurt Wostyn, Gavin Simpson, Andy Steinbach, Paul W. Mertens

Keywords:

Localized Haze Data, Particle Removal Efficiency

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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[1] K. Xu et al., Solid State Phenomena Vol. 92 (2003) 161.

[2] K. Xu, Nano-sized particles: quantification and removal by brush scrubber cleaning, PhD thesis in Chemistry at KULeuven (2004).

[3] M. O. Schmidt et al., Solid State Phenomena Vol 92 (2003) 147.

[4] A. Eitoku et al., Solid State Phenomena Vol 92 (2003) 157.

[5] G. Vereecke et. al, 204th ECS meeting (2003) abstract 778.

[6] K. Xu et al.,. 204th ECS meeting (2003) abstract 777.

[7] K. Xu et al., J. Vac. Sci. Technol. B 23(5) (2005) 2160. Fig. 2: Localized PRE map for condition B.

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[20] [40] [60] [80] 100 A B C D E PRE(%) Radial distance R Fig. 3: Radial dependence of the PRE for different process conditions @2 MHz.

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[1] [10] 100 1000 10000 A B C D E Cummmulative damage PRE(%) Fig. 5: Cummulative damage versus PRE for different process conditions @ 2MHz.

50 100 150 200 250 300.

[20] [40] [60] [80] 100 Radius: 0 4. 2 8. 4 15.

[20] 40 90 average PRE(%) Cleaning time(s) Fig 7: Localized dynamics of PRE at different radial distances @1MHz.

20 40 60 80 100.

[10] [20] [30] [40] [50] A B Damage per device PRE(%).

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[50] 100 150 200 250 C Damage per device PRE(%) Fig. 4: Local correlation between PRE and damage pre device for different process conditions @ 2MHz : (a) cond A, B; (b) conditionC.

20 40 60 80 100.

[20] [40] [60] [80] 100.

[10] [30] [60] [90] 120 240 PRE(%) Radial distance (mm) Fig. 6: Dynamics the PRE for fixed conditions @1 MHz.

20 40 60 80 100 1E-3 0. 01 0. 1 fr fr. R Particle removal frequency fR Radial distance Fig 8: Radial dependence of particle removal frequency @1MHz.