Impact of Re-Gasified Water on Megasonic Cleaning

Boon Cheng Goh; Felicia Goh; Christopher Lim; Zainab Ismail; Mei Sheng Zhou

doi:10.4028/www.scientific.net/SSP.134.217

Paper Titles

Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes
p.201

New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge
p.205

Low Si Recess on Cleaning Process by Dilute HF/SC-1 with Megasonic
p.209

Preparation, Characterization, and Damage-Free Processing of Advanced Multiple-Gate FETs
p.213

Impact of Re-Gasified Water on Megasonic Cleaning
p.217

The Removal of Silica Particles from Micron Wide Trenches by Megasonic Cleaning
p.221

Is there Gas Entrapped on Submerged Silicon Wafers? Visualizing Nano-Scale Bubbles with Cavitation
p.225

Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal
p.229

Study of the Dynamics of Local Particle Removal Efficiencies Using Localized Haze Maps
p.233

HomeSolid State PhenomenaSolid State Phenomena Vol. 134Impact of Re-Gasified Water on Megasonic Cleaning

Impact of Re-Gasified Water on Megasonic Cleaning

Abstract:

Megasonic cleaning using de-gassed water (less than 2ppm N2, O2, CO2) in a 300mm batch immersion tool often does not give optimal particle performance, with particle streaks and clusters added onto the wafer, and low particle removal efficiency (PRE). When water was re-gasified with N2, the resultant stable cavitation activity reduced particle adders and increased PRE. With N2 concentration increased to just above 5ppm, number of particle adders decreased by three folds. Optimal particle performance could be obtained by operating at an N2 level close to saturation.