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HomeSolid State PhenomenaSolid State Phenomena Vol. 134Investigation of Metallic Contamination Analysis...

Investigation of Metallic Contamination Analysis Using Vapor Phase Decomposition – Droplet Collection – Total Reflection X-Ray Fluorescence (VPD-DC-TXRF) for Pt-Group Elements on Silicon Wafers

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Ultra Clean Processing of Semiconductor Surfaces VIII

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

273-276

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.273

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Online since:

November 2007

Authors:

David Hellin, Nick Valckx, Jens Rip, Stefan De Gendt, Chris Vinckier

Keywords:

Collection, Droplet Residue, Outplating, Pt-Group, TXRF, VPD-DC

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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