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HomeSolid State PhenomenaSolid State Phenomena Vol. 134Novel Full Wafer Inspection Technology for...

Novel Full Wafer Inspection Technology for Non-Visual Residue Defects

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Ultra Clean Processing of Semiconductor Surfaces VIII

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

289-292

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.289

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Online since:

November 2007

Authors:

Robert Bryant, Joel Hickson, Jeff Hawthorne

Keywords:

Contact Potential Difference Imaging, CPDI, Non-Visual Residue Defects, NVR, Wafer Inspection, Work Function

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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