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HomeSolid State PhenomenaSolid State Phenomena Vol. 134Effect of an Organic Inhibitor in High pH Chemical...

Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

299-302

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.299

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Online since:

November 2007

Authors:

Sébastien Petitdidier, Kyle Bartosh, Chantal Trouiller, Alexandre Couvrat, Jun Liu, Mark Zaleski

Keywords:

BTA, Cu CMP, Inhibitor, Post CMP Cleaning, ToF-SIMS

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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