Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP

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Periodical:

Solid State Phenomena (Volume 134)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

299-302

DOI:

10.4028/www.scientific.net/SSP.134.299

Citation:

S. Petitdidier et al., "Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP", Solid State Phenomena, Vol. 134, pp. 299-302, 2008

Online since:

November 2007

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$35.00

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