For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Advanced TXRF Analysis: Background Reduction when Measuring High-k Materials and Mapping Metallic Contamination
p.285
Novel Full Wafer Inspection Technology for Non-Visual Residue Defects
p.289
A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing
p.295
Effect of an Organic Inhibitor in High pH Chemical Rinse on the Platen for Cu-CMP
p.299
The Dependence of Chemical Mechanical Polishing Residue Removal on Post-Cleaning Treatments
p.303
A Novel Surface Cleaning for Copper Interconnection Using Ammonium Decomposed Species Generated by Hot Wire
p.307
Improvement of Contact Clean Using Single-Wafer Clean Process for 90nm and Beyond
p.313
Effects of Bias, Pressure and Temperature in Plasma Damage of Ultra Low-k Films
p.317
Impact of Plasma and Diluted HF on a CoWP Material
p.321

The Dependence of Chemical Mechanical Polishing Residue Removal on Post-Cleaning Treatments

Article Preview

Abstract:

You might also be interested in these eBooks
Ultra Clean Processing of Semiconductor Surfaces VIII View Preview

Info:

Periodical:

Solid State Phenomena (Volume 134)

Pages:

303-306

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.303

Citation:

Cite this paper

Online since:

November 2007

Authors:

Jae Gon Choi, Hyo Geun Yoon, Woo Jin Kim, Geun Min Choi, Young Wook Song, Jin Goo Park

Keywords:

Cleaning, CMP Process, Defect, Dishing Effect, Etching Rate

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2008 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] Yong-Soo Choi, et. al, PacRim, (2004), P. 103.

Google Scholar

[2] Woo-Jin Lee, et. al, Thin solid film, (2005), P. 145.

Google Scholar

[3] D. J. Riley, et. al, Proc. 36th Ann. Tech. Meeting of the Ins. of Envir. Science, (1990) 224.

Google Scholar

[4] M. Itano, et. al, IEEE Trans. Semicond. Manufact., Vol. 5, No. 2 (1992) 114.

Google Scholar

[5] M. Itano, et. al, IEEE Trans. Semicond. Manufact., Vol. 6, No. 3 (1993) 258.

Google Scholar

[6] M. Itano, et. al. IEEE Trans, no. 3, (1993).

Google Scholar

03.

Google Scholar

05.

Google Scholar

07.

Google Scholar

09.

Google Scholar

11.

Google Scholar

13.

Google Scholar

15.

Google Scholar

17.

Google Scholar

19.

Google Scholar

21.

Google Scholar

23.

Google Scholar

25.

Google Scholar

27.

Google Scholar

29 Defect size(um) ea 0 100 200 300 400 500 0. 01.

Google Scholar

03.

Google Scholar

05.

Google Scholar

07.

Google Scholar

09.

Google Scholar

11.

Google Scholar

13.

Google Scholar

15.

Google Scholar

17.

Google Scholar

19.

Google Scholar

21.

Google Scholar

23.

Google Scholar

25.

Google Scholar

27.

Google Scholar

29 Defect size(um) ea 0 100 200 300 400 500 0. 01.

Google Scholar

03.

Google Scholar

05.

Google Scholar

07.

Google Scholar

09.

Google Scholar

11.

Google Scholar

13.

Google Scholar

15.

Google Scholar

17.

Google Scholar

19.

Google Scholar

21.

Google Scholar

23.

Google Scholar

25.

Google Scholar

27.

Google Scholar

29 Defect size(um) ea Before After BOE-H After BOE-L.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.