Effects of Bias, Pressure and Temperature in Plasma Damage of Ultra Low-k Films

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Periodical:

Solid State Phenomena (Volume 134)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

317-320

Citation:

A.M. Urbanowicz et al., "Effects of Bias, Pressure and Temperature in Plasma Damage of Ultra Low-k Films ", Solid State Phenomena, Vol. 134, pp. 317-320, 2008

Online since:

November 2007

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[1] K. Maex et al. J. Appl. Phys. 93(11), 8793, (2003).

[2] M.A. Worsley et al., J. Vac. Sci. technol., B23, 395, (2005).

[3] A. Grill, V. Patel. J. Electrochem. Soc., 153, F169, (2006).

[4] M.R. Baklanov, K.P. Mogilnikov, Q.T. Le. Microel. Eng., to be published.

[5] M.R. Baklanov et al. Proc. of 8 th Int. Conf. on Sol. -St. & Integrated-Circuit Technol. Shanghai, (2006).

[6] R. Mills et al. J. Phys. D: Appl. Phys., 36, 1535, 2003; R. Mills et al., Int.J. Hydr. Energy, 28, 1401, (2003).

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