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HomeSolid State PhenomenaSolid State Phenomena Vol. 134Impact of Organic Acid and Gas Bubbling on Copper...

Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

333-336

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.333

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Online since:

November 2007

Authors:

Diane Rébiscoul, N. Lopez, Lucile Broussous, Didier Louis, G. Passemard

Keywords:

Copper (Cu), Organic Acid, Post-Etch Cleaning

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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DOI: 10.1109/iitc.2004.1345739

[2] D. Rébiscoul, B. Puyrenier, L. Broussous, D. Louis, G. Passemard, Proceedings of MAM2006 conference, Grenoble, (2007).

[3] D. Rébiscoul, L. Broussous, D. Louis, G. Passemard - ECS transactions - Cleaning Technology in Semicondutor Device Manufacturing IX, 1, 3, (2005) p.365.

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