Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution

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Periodical:

Solid State Phenomena (Volume 134)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

333-336

DOI:

10.4028/www.scientific.net/SSP.134.333

Citation:

D. Rébiscoul et al., "Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution", Solid State Phenomena, Vol. 134, pp. 333-336, 2008

Online since:

November 2007

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