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Optimization of a SC CO₂ Post-Etch Cleaning for Copper Interconnections

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

345-349

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.345

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Online since:

November 2007

Authors:

Diane Rébiscoul, V. Perrut, C. Ventosa, M. Assous, Didier Louis, G. Passemard

Keywords:

Chelatant, Copper (Cu), Post-Etch Cleaning, Rotation, Supercritical CO₂

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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DOI: 10.4028/www.scientific.net/ssp.103-104.327

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[5] D. Rébiscoul, L. Broussous, D. Louis, G. Passemard - ECS transactions - Cleaning Technology in Semicondutor Device Manufacturing IX, 1, 3, (2005) p.365.

[6] S.M. Chitanvis & al., Supercritical fluid Cleaning. Fundamentals, Technology and Applications Ed. McHardy J., Sawan S.P., Westwood : Noyes Publications, (1998), pp.70-86.

[7] D. Rebiscoul, V. Perrut, C. Ventosa, Didier Louis , Gérard Passemard, Proceeding of the Eight Conference on Supercritical Fluids and their Applications, Ischia, may 28-31 (2006).