Optimization of a SC CO2 Post-Etch Cleaning for Copper Interconnections

Abstract:

Article Preview

Info:

Periodical:

Solid State Phenomena (Volume 134)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

345-349

DOI:

10.4028/www.scientific.net/SSP.134.345

Citation:

D. Rébiscoul et al., "Optimization of a SC CO2 Post-Etch Cleaning for Copper Interconnections", Solid State Phenomena, Vol. 134, pp. 345-349, 2008

Online since:

November 2007

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.