Paper Titles

Marangoni Dryer Integrated High Performance Cleaner for Cu/Low k Post Strip Clean for 45nm Technology Node and Beyond
p.337

Effect of Pressure Pulsation on Post-Etch Photoresist Stripping on Low-k Films in Supercritical CO₂
p.341

Optimization of a SC CO₂ Post-Etch Cleaning for Copper Interconnections
p.345

Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect
p.351

Effect of Wafer Rotation on Photoresist Stripping in Supercritical CO₂
p.355

Metal Hard Mask Employed Cu/Low k Film Post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow
p.359

Mechanism and Principles of Post Etch Al Cleaning with Inorganic Acids
p.363

AlCu Metal Line Corrosion: A Case Study
p.367

Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues
p.371

HomeSolid State PhenomenaSolid State Phenomena Vol. 134Effect of Wafer Rotation on Photoresist Stripping...

Effect of Wafer Rotation on Photoresist Stripping in Supercritical CO₂

Article Preview

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Semiconductor Surfaces VIII

Info:

Periodical:

Solid State Phenomena (Volume 134)

Pages:

355-358

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.355

Citation:

Cite this paper

Online since:

November 2007

Authors:

Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori, K. Saito, I. Mizobata, T. Iwata, S. Hirae

Keywords:

Low-k Films, Photoresist Stripping, Supercritical CO₂, Wafer Rotation

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2008 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: