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HomeSolid State PhenomenaSolid State Phenomena Vols. 69-70Structural and Electrical Quality of Silicon...

Structural and Electrical Quality of Silicon Bicrystals Fabricated by a Modified Direct Bonding Technique

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Gettering and Defect Engineering in Semiconductor Technology VIII

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Periodical:

Solid State Phenomena (Volumes 69-70)

Pages:

491-496

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.69-70.491

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Online since:

August 1999

Authors:

T.S. Argunova, Mikhail Yu. Gutkin, L.S. Kostina, T.V. Kudriavtseva, Eun Dong Kim, Sang Cheol Kim

Keywords:

Grooved Interfaces, Silicon Direct Bonding, Structural Quality, Vacuum Annealing (VA)

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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