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HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77Post SiN Etching Cleaning During Copper and Low K...

Post SiN Etching Cleaning During Copper and Low K Integration

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Ultra Clean Processing of Silicon Surfaces V

Info:

Periodical:

Solid State Phenomena (Volumes 76-77)

Pages:

101-104

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77.101

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Online since:

January 2001

Authors:

Alessio Beverina, Didier Louis, C. Arvet, E. Lajoinie, Pascal Besson, C. Peyne, Douglas Holmes, D. Maloney, S. Lee, W.M. Lee

Keywords:

Cleaning, Copper (Cu), Low K

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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