Post SiN Etching Cleaning During Copper and Low K Integration

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Periodical:

Solid State Phenomena (Volumes 76-77)

Edited by:

Marc Heyns, Marc Meuris and Paul Mertens

Pages:

101-104

DOI:

10.4028/www.scientific.net/SSP.76-77.101

Citation:

A. Beverina et al., "Post SiN Etching Cleaning During Copper and Low K Integration", Solid State Phenomena, Vols. 76-77, pp. 101-104, 2001

Online since:

January 2001

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$35.00

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