Paper Titles

Complexing Agents Employed in Single Chemistry Cleaning: Stability Studies Using HPLC
p.37

Stability and Residue Studies of Complexing Agents in SC-1 Bath
p.41

Single Wafer Immersion Process Incorporating a Novel Megasonics Configuration with an Advanced IPA Vapor Condensation Dry
p.45

Metallic Contamination Removal Evaluation for Single Wafer Processing
p.49

Procedure to Evaluate Particle-Substrate Interaction during Immersion in Liquid
p.53

Surfactant Selection for AM Clean in a Single Wafer Oasis Wet System
p.57

Investigating Post CMP Cleaning Processes for STI Ceria Slurries
p.63

Long-Term Effect of Transportation on Particle Concentrations in Various Process Chemicals
p.69

A New Industrial Etching & Drying Process for MEMS to Prevent Collapse of Microstructures
p.73

HomeSolid State PhenomenaSolid State Phenomena Vol. 92Procedure to Evaluate Particle-Substrate...

Procedure to Evaluate Particle-Substrate Interaction during Immersion in Liquid

Article Preview

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Silicon Surfaces VI

Info:

Periodical:

Solid State Phenomena (Volume 92)

Pages:

53-56

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92.53

Citation:

Cite this paper

Online since:

May 2003

Authors:

Wim Fyen, J. Vansteenbergen, Kai Dong Xu, Rita Vos, Paul W. Mertens, Marc Heyns

Keywords:

Diffusion, Evaporated Thickness, Interaction, Particle Deposition

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2003 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: