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HomeSolid State PhenomenaSolid State Phenomena Vol. 92Single Wafer Immersion Process Incorporating a...

Single Wafer Immersion Process Incorporating a Novel Megasonics Configuration with an Advanced IPA Vapor Condensation Dry

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Abstract:

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Periodical:

Solid State Phenomena (Volume 92)

Pages:

45-48

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.92.45

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Online since:

May 2003

Authors:

J.J. Rosato, E.G. Baiya, J.A. Imonigie, M.R. Yalamanchili, E. Hansen

Keywords:

Etching, Immersion, IPA Vapor Drying, Megasonics, Single Wafer, Surface Preparation, Wafer Cleaning

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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