Advances in Abrasive Technology XIII

Volumes 126-128

doi: 10.4028/

Paper Title Page

Authors: A.M.M. Sharif Ullah, Junichi Tamaki, Akihiko Kubo

Abstract: The main body of grinding knowledge comes from the experiments done by independent investigators. If such experimental results are not made...

Authors: Chao Ching Ho, Tzu Hsin Kuo, Tsung Ting Tsai

Abstract: The development of robust condition monitoring system for a machine tool spindle is an important task because the spindle has a significant...

Authors: T. Tachikawa, Kazuhito Ohashi, M. Tago, Shinya Tsukamoto

Abstract: The purpose of this study is to develop an in-process of measurement technique of surface roughness using thermoelectric effect in...

Authors: David Lee Butler

Abstract: Surface measurement using three-dimensional stylus instruments is a relatively new technique that offers numerous advantages over more...

Authors: Gui Jian Xiao, Yun Huang, Z. Huang, Li Na Si

Abstract: The roundness error is researched in the process of coordinate polishing crankshaft crankpin with abrasive belt by measuring online. A...

Authors: Teppei Onuki, Takashi Tokizaki, Hirotaka Ojima, Jun Shimizu, Li Bo Zhou

Abstract: Pattern size controllability of SPM-based nano-lithography especially in vertical direction was improved using in-situ height and depth...

Authors: Jun Zhang, Bo Liu, Min Qian, Xiang Long Zhu, Ren Ke Kang

Abstract: A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers

Authors: Ginsuke Kono, Takaharu Kuroda, Teruyoshi Daitoh, Kuniaki Maruoka

Abstract: Recently, the screens of TVs and computers are getting larger and larger. In accordance to that, surface plates of those, which are used...

Authors: Chia Liang Yen, Ming Chyuan Lu, Jau Liang Chen

Abstract: The Acoustic Emission signal was studied in this report for tool wear monitoring in micro milling. An experiment was conducted first...

Authors: Gunsei Kimoto, Takehiro Watanabe, Souta Matsusaka, Akio Inoue, Takaharu Kuroda

Abstract: We present a new type of wafer probe card with resin film consisting of two beams. Resin film is embedded on both sides of the probe beam,...


Showing 111 to 120 of 169 Paper Titles