Manufacturing Engineering and Automation I

Volumes 139-141

doi: 10.4028/www.scientific.net/AMR.139-141

Paper Title Page

Authors: Xiao Xia Zhang, Yong Tang, Zhen Ping Wan, Su Lian Tao

Abstract: A new method of rolling-plowing-extrusion is proposed for fabricating outside 3D integral fins on the stainless steel tube. The fabricated...

1392
Authors: Lei Li, Zhen Zhou Lv, Liang Bo Ao, Ming Yu, Zhu Feng Yue

Abstract: In this paper, the multidisciplinary design optimization based on Approximation Model for supercharge turbo is studied. Temperature and...

1396
Authors: Wang Yu Liu, Yong Zhang

Abstract: The bend-twist coupling design method of spar cap of 1.5MW wind turbine blade made by biased hybrid fibers is discussed, and the coupling...

1400
Authors: Ping Wang, Zhou Lan, Xiao Yang Shen

Abstract: . For a medium or large-sized gear drive, in order to achieve the optimum weight reduction effect, an approach of weight reduction design is...

1406
Authors: Xiao Yang Shen, Zhi Jun Zheng, Ping Wang

Abstract: In order to enhance design reliability of a co-rotating twin screw pulping extruder (TSPE), optimum design on screw parameters of the TSPE...

1411
Authors: Jian Jun Yu

Abstract: Production scheduling is the key for the enterprise efficiency improvement, and is hot research topic for the advanced manufacturing all the...

1415
Authors: Yun Lin Fu, Yong Feng Li, Yi Xing Liu, Bao Gang Wang

Abstract: A novel Wood-Polymer Composite, Wood-PSt composite combining both advantages of wood and polystyrene was fabricated by determining the...

1419
Authors: Wei Wang, Yong Xian Liu, Fei Xing, Hua Long Xie

Abstract: At present there are a lot of waste of energy in the mechanical processing, which causes increasingly serious pollution of environment....

1424
Authors: Zhi Feng Liu, Liu Xian Zhao, Xin Yu Li, Hong Chao Zhang, Huan Bo Cheng

Abstract: The electronic products continue to upgrade at present, how to recycle the discarded electronic products is one of the key research of green...

1428
Authors: Kai Lin Pan, Jiao Pin Wang, Jing Liu, Guo Tao Ren

Abstract: Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance...

1433

Showing 311 to 320 of 599 Paper Titles