Gapfill Study of Polyimides for MEMS Applications

Steven Lee Hou Jang; Wee Ming Tan; Ying Jun Mao; Ramana Murthy; Nagarajan Ranganathan

doi:10.4028/www.scientific.net/AMR.254.54

Paper Titles

On the Way to the Bionic Man: A Novel Approach to MEMS Based on Biological Sensory Systems
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Design Consideration of Membrane Structure for Thermal Actuated Micropump
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Developing High Sensitivity Biomass Sensor Using Lamé Mode Square Resonator
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Fabrication of a Peltier Device Based on InSb and SbTe Thin Films
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Gapfill Study of Polyimides for MEMS Applications
p.54

A Simple Method for Quantification of Beta-Amyloid Using the Photo-Sensitive Thin Film Transistor
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Wireless Imaging Module Assembly and Integration for Capsule Endoscopic Applications
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Low Cost and High Resolution X-Ray Lithography for Fabrication of Microactuator
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FBAR Resonators with Sufficient High Q for RF Filter Implementation
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 254Gapfill Study of Polyimides for MEMS Applications

Gapfill Study of Polyimides for MEMS Applications

Abstract:

Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS’ (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical properties and have been commonly used for electrical insulation as well as device passivation and protection. In addition, these organic spin-on polymers serve as excellent sacrificial materials for forming cavities on MEMS structures. This work studies the gapfill properties of several polyimides after spin-coating and curing. In addition, this work examines and compares the gapfilling and planarization properties of a number of different polyimides, including multiple layers of polyimides for gapfilling and planarization.

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Periodical:

Advanced Materials Research (Volume 254)

Pages:

54-57

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.254.54

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Online since:

May 2011

Authors:

Steven Lee Hou Jang, Wee Ming Tan, Ying Jun Mao, Ramana Murthy, Nagarajan Ranganathan

Keywords:

CMP, Gapfill, Micro-Electromechanical System (MEMS), Polyimide, Spin Coating

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References

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