Gapfill Study of Polyimides for MEMS Applications

Abstract:

Article Preview

Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS’ (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical properties and have been commonly used for electrical insulation as well as device passivation and protection. In addition, these organic spin-on polymers serve as excellent sacrificial materials for forming cavities on MEMS structures. This work studies the gapfill properties of several polyimides after spin-coating and curing. In addition, this work examines and compares the gapfilling and planarization properties of a number of different polyimides, including multiple layers of polyimides for gapfilling and planarization.

Info:

Periodical:

Edited by:

Lynn Khine and Julius M. Tsai

Pages:

54-57

DOI:

10.4028/www.scientific.net/AMR.254.54

Citation:

S. L. H. Jang et al., "Gapfill Study of Polyimides for MEMS Applications", Advanced Materials Research, Vol. 254, pp. 54-57, 2011

Online since:

May 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.