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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 194-199Diffusion Creep of Silicon during Direct Silicon...

Diffusion Creep of Silicon during Direct Silicon Wafer Bonding

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Diffusion in Materials DIMAT2000

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Periodical:

Defect and Diffusion Forum (Volumes 194-199)

Pages:

667-672

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.194-199.667

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Online since:

April 2001

Authors:

E. Belyakova, N. Shmidt, V.V. Ratnikov, Alex A. Kamanin, Eun Dong Kim, Sang Cheol Kim

Keywords:

Bonding, Diffusion Creep, Impurity, Silicon

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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