Towards a Fully Integrated 4H-SiC A-Plane Quantum-Chip – Transistors and Light Emitters

Article Preview

Abstract:

Silicon vacancies (VSi) are relevant for quantum technologies, including sensing, computing, and communication. For the realization of quantum photonic integrated circuits (QPICs) and, therefore, co-integration of optical and electrical devices with resonant excitation through the wafer surface, a-plane 4H-SiC wafers are required. Transferring established complementary metal-oxide-semiconductor (CMOS)-compatible processes from c-plane to a-plane wafers is, therefore, a crucial step. In this work, key fabrication steps, namely ion implantation, thermal oxidation, and ohmic contact formation, were investigated for a-plane 4H-SiC substrates. To demonstrate successful process transfer, p-channel MOS field-effect transistors were fabricated and electrically characterized, showing comparable Ion/Ioff ratios and mobilities to their c-plane counterparts, but with a threshold voltage shift from −7.1 V to −12.0 V on the a-plane. Additionally, tunneling diodes were realized as broadband light emitters, with a significant portion of the emission spectrum falling within the range of off-resonant excitation of VSi centers. The devices maintained light emission functionality down to cryogenic temperatures.

You have full access to the following eBook

Info:

* - Corresponding Author

[1] G. Moody, V.J. Sorger, D.J. Blumenthal, et al., 2022 Roadmap on integrated quantum photonics, J. Phys. Photonics 4 (2022) 12501.

Google Scholar

[2] D. Scheller, F. Hrunski, J.H. Schwarberg, et al., Quantum-enhanced electric field mapping within semiconductor devices, Phys. Rev. Applied (2025).

DOI: 10.1103/pv13-vgcw

Google Scholar

[3] S.K. Parthasarathy, B. Kallinger, F. Kaiser, et al., Scalable quantum memory nodes using nuclear spins in Silicon Carbide, Phys. Rev. Applied 19 (2023) 11048.

DOI: 10.1103/physrevapplied.19.034026

Google Scholar

[4] N.T. Son, C.P. Anderson, A. Bourassa, et al., Developing silicon carbide for quantum spintronics, Appl. Phys. Lett. 116 (2020) 190501.

Google Scholar

[5] Y. Zhou, J. Tan, H. Hu, et al., Silicon carbide: A promising platform for scalable quantum networks, Applied Physics Reviews 12 (2025).

Google Scholar

[6] C.P. Anderson, A. Bourassa, K.C. Miao, et al., Electrical and optical control of single spins integrated in scalable semiconductor devices, Science 366 (2019) 1225–1230.

DOI: 10.1126/science.aax9406

Google Scholar

[7] R. Nagy, M. Niethammer, M. Widmann, et al., High-fidelity spin and optical control of single silicon-vacancy centres in silicon carbide, Nature communications 10 (2019) 1954.

DOI: 10.1038/s41467-019-09873-9

Google Scholar

[8] A. May, M. Rommel, L. Baier, et al., A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C, in: 2024 Smart Systems Integration Conference and Exhibition (SSI), IEEE, 2024, p.1–5.

DOI: 10.1109/ssi63222.2024.10740550

Google Scholar

[9] J.H. Schwarberg, R. Karhu, B. Kallinger, et al., Investigation of CMOS Single Process Steps on 4H-SiC a-Plane Wafers for Quantum Applications, in: 2024 47th MIPRO ICT and Electronics Convention (MIPRO), IEEE, 2024, p.1566–1572.

DOI: 10.1109/mipro60963.2024.10569589

Google Scholar

[10] D. Goto, Y. Hijikata, S. Yagi, H. Yaguchi, Differences in SiC thermal oxidation process between crystalline surface orientations observed by in-situ spectroscopic ellipsometry, Journal of Applied Physics 117 (2015).

DOI: 10.1063/1.4914050

Google Scholar

[11] K. Zekentes, K. Vasilevskiy, Advancing Silicon Carbide Electronics Technology I, Materials Research Forum LLC, 2018.

DOI: 10.21741/9781945291852

Google Scholar

[12] L.M. Terman, An investigation of surface states at a silicon/silicon oxide interface employing metal-oxide-silicon diodes, Solid-State Electronics 5 (1962) 285–299.

DOI: 10.1016/0038-1101(62)90111-9

Google Scholar

[13] A. May, L. Baier, M. Rommel, Temperature Dependence of 4H-SiC Gate Oxide Breakdown and C-V Properties from Room Temperature to 500 °C, SSP 358 (2024) 51–58.

DOI: 10.4028/p-6t2lbm

Google Scholar

[14] P. Friedrichs, E.P. Burte, R. Schörner, Dielectric strength of thermal oxides on 6H-SiC and 4H-SiC, Applied Physics Letters 65 (1994) 1665–1667.

DOI: 10.1063/1.112904

Google Scholar

[15] S.M. Sze, Y. Li, K.K. Ng, Physik der Halbleiterbauelemente, Wiley-VCH GmbH, Weinheim, 2022.

Google Scholar

[16] A. Ortiz-Conde, F.J. García-Sánchez, J. Muci, et al., Revisiting MOSFET threshold voltage extraction methods, Microelectronics Reliability 53 (2013) 90–104.

DOI: 10.1016/j.microrel.2012.09.015

Google Scholar

[17] H. Yang, H. Inokawa, A differential smoothing technique for the extraction of MOSFET threshold voltage using extrapolation in the linear region, Solid-State Electronics 76 (2012) 5–7.

DOI: 10.1016/j.sse.2012.05.065

Google Scholar

[18] J. Schwarberg, C. Gobert, F. Hrunski, et al., Scalable Fabrication and Electrical Characterization of Lateral pin-Diodes on 4H-SiC a-Plane Wafers for Functionalization of Silicon Vacancies, 22nd ICSCRM - manuscript accepted (2025).

Google Scholar

[19] S. Ultsch, J. Dick, J. Schwarz, J. Schulze, Electroluminescent Behavior of Defects in 4H-SiC Light Emitting Diodes, in: 2025 MIPRO 48th ICT and Electronics Convention, IEEE, 2025, p.1685–1690.

DOI: 10.1109/mipro65660.2025.11132079

Google Scholar

[20] J. Dick, S. Ultsch, M. Rommel, J. Schulze, 4H-SiC Tunneling Light Emitter as a Light-Source for Off-Resonant Excitation of Silicon Vacancies, 22nd ICSCRM - manuscript accepted (2025).

Google Scholar

[21] X. Yang, Z. Yang, M. Porter, et al., First Characterization of Si IGBT, SiC MOSFET, and GaN HEMT at Deep Cryogenic Temperatures down to 10 Millikelvins, IEEE Trans. Power Electron. (2025) 1–13.

DOI: 10.1109/tpel.2025.3601008

Google Scholar

[22] W.J. Choyke (Ed.), Silicon carbide: Recent major advances, Springer, Berlin, Heidelberg, 2004.

Google Scholar