Paper Title
Authors: Meng Kao Yeh, In Shung Lee
Abstract:The delamination problem in plastic ball grid array electronic package was investigated analytically and experimentally. The ANSYS code was...
Authors: Shiuh Chuan Her, Wei-Bo Su
Abstract:Multi-layer structures are common in electronic package especially for the micro devices manufactured via the semi-conductor processes or...
Authors: Heung Soo Kim, Seung Bok Choi, Jae Hwan Kim
Abstract:A dynamic analysis method has been developed to investigate and characterize the effect due to the presence of discrete single and multiple...
Authors: Shun Fa Hwang, Horng Ming Chen
Abstract:Compression tests are conducted on composite laminates consisting of 16 unidirectional carbon/epoxy layers with two through-width...
Authors: Hiroyuki Waki, Izuru Nishikawa, Akira Ohmori
Abstract:Thermal barrier coating (TBC) on the element for high temperature service, such as a gas turbine blade, has become an indispensable...
Authors: Jin Long Chen, Cuiru Sun, Yu Wen Qin, Xin Hua Ji
Abstract:When a sandwich structure is loaded in uniaxial in-plane compression the skin over the debonded region may buckle allowing further...
Authors: De Liang Ren, Bo Liao, Changling Xu, Lianhai Hu, Fu Ren Xiao
Abstract:By using the mathematical uniform design, a new agglomerated flux for high speed and multi-arc submerged arc welding (SAW) has been developed...
Authors: Ouk Sub Lee, Dong Hyeok Kim, No Hoon Myoung, Si Won Hwang
Abstract:Pipelines widely used for the transportation of varying fluids from one place to another should be maintained in good condition to avoid, if...
Authors: Hyo Jin Kim, Do Won Seo, Jae Kyoo Lim, Toru Fujii
Showing 61 to 70 of 253 Paper Titles