Fracture and Strength of Solids VI

Volumes 306-308

doi: 10.4028/

Paper Title Page

Authors: Meng Kao Yeh, In Shung Lee

Abstract: The delamination problem in plastic ball grid array electronic package was investigated analytically and experimentally. The ANSYS code was...

Authors: Shiuh Chuan Her, Wei-Bo Su

Abstract: Multi-layer structures are common in electronic package especially for the micro devices manufactured via the semi-conductor processes or...

Authors: Heung Soo Kim, Seung Bok Choi, Jae Hwan Kim

Abstract: A dynamic analysis method has been developed to investigate and characterize the effect due to the presence of discrete single and multiple...

Authors: Shun Fa Hwang, Horng Ming Chen

Abstract: Compression tests are conducted on composite laminates consisting of 16 unidirectional carbon/epoxy layers with two through-width...

Authors: Hiroyuki Waki, Izuru Nishikawa, Akira Ohmori

Abstract: Thermal barrier coating (TBC) on the element for high temperature service, such as a gas turbine blade, has become an indispensable...

Authors: Jin Long Chen, Cuiru Sun, Yu Wen Qin, Xin Hua Ji

Abstract: When a sandwich structure is loaded in uniaxial in-plane compression the skin over the debonded region may buckle allowing further...

Authors: De Liang Ren, Bo Liao, Changling Xu, Lianhai Hu, Fu Ren Xiao

Abstract: By using the mathematical uniform design, a new agglomerated flux for high speed and multi-arc submerged arc welding (SAW) has been...

Authors: Ouk Sub Lee, Dong Hyeok Kim, No Hoon Myoung, Si Won Hwang

Abstract: Pipelines widely used for the transportation of varying fluids from one place to another should be maintained in good condition to avoid, if...

Authors: Hyo Jin Kim, Do Won Seo, Jae Kyoo Lim, Toru Fujii

Showing 61 to 70 of 253 Paper Titles