Advances in Grinding and Abrasive Technology XIV

Volumes 359-360

doi: 10.4028/www.scientific.net/KEM.359-360

Paper Title Page

Authors: Zi Rui Pang, Suo Xian Yuan, Wan Shan Wang, Chun Xia Zhu

Abstract: In this paper, we emphasize that residual stresses in a ground surface are primarily generated due to grinding zone temperature effect, and...

239
Authors: Chang He Li, Shi Chao Xiu, Guang Qi Cai

Abstract: The surface integrity finished by abrasive jet with grinding wheel as restraint was experimentally investigated. Experiments were performed...

244
Authors: Zeng Qiang Li, Tao Sun, Yong Da Yan, Jun Jie Zhang, Ying Chun Liang, Shen Dong

Abstract: Molecular dynamics is a rapidly developing field of science and has become an established tool for studying the dynamic behavior of...

249
Authors: Jian Xiu Su, Xue Liang Zhang, Xi Qu Chen, Jia Xi Du, Dong Ming Guo

Abstract: Right getting hold of the contact form between the wafer and the pad is the precondition of fully understanding the material removal...

254
Authors: Pai Shan Pa

Abstract: In order to elevate the efficiency of the surface finish to reach the fast improvement of the surface roughness of the workpiece, so as to...

259
Authors: Wen Jie Zhai, Chang Xiong Liu, Pei Lian Feng

Abstract: The average Reynolds equation and average clearance equation of circular translational polishing (CTP) under the quasi-stable mixed...

264
Authors: Fei Hu Zhang, Hua Li Zhang, Yong Da Yan, Jing He Wang

Abstract: Nanomachining tests have been conducted on single-crystal Al using atomic force microscope to simulate single-blade machining process of...

269
Authors: Li Hua Dong, Chun Hua Fan, Jian Huang, Hong Xia Luo

Abstract: The application of hard and brittle materials become wider and wider because its self-characteristics. It is used widely in finish...

274
Authors: Juan Liu, Xipeng Xu

Abstract: In this paper, a newly developed ultra-fine abrasive polishing pad by gel technology was adopted to polish silicon wafer on a...

279
Authors: Rong Fa Chen, Dun Wen Zuo, Wen Zhuang Lu, Duo Sheng Li, Feng Xu, Tong Ji, Min Wang

Abstract: In the present work, high power DC arc plasma jet chemical vapor deposition (CVD) is used to prepare diamond films with full width half...

285

Showing 51 to 60 of 118 Paper Titles