High Mobility Ge-Based CMOS Device Technologies

Article Preview

Abstract:

In this paper, we report on critical issues and possible solutions for realizing Ge MOSFETs on the Si platform. The main critical objectives in regard to Ge MOSFETs are (1) formation of high quality Ge channel layers on Si substrates (2) MIS gate stacks with much smaller EOT and interface defects (3) superior source/drain junction technology (4) combination of mobility booster technologies such as surface orientation and strain. We demonstrate that GeO2/Ge MOS interfaces can provide superior interface properties, leading to high hole and electron mobility. It is also shown that a gas phase doping technique is promising for forming superior n+/p junctions, which is critical for obtaining Ge nMOSFETs. Also, the importance of surface orientation engineering on the further mobility enhancement of Ge CMOS is addressed.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

1-7

Citation:

Online since:

February 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] S. Takagi, T. Tezuka, T. Irisawa, S. Nakaharai, T. Numata, K. Usuda, N. Sugiyama, M. Shichijo, R. Nakane, S. Sugahara, Solid-State Electron., Vol. 51 (2007) p.526.

DOI: 10.1016/j.sse.2007.02.017

Google Scholar

[2] S. Takagi, T. Irisawa, T. Tezuka, T. Numata, S. Nakaharai, N. Hirashita, Y. Moriyama, K. Usuda, E. Toyoda, S. Dissanayake, M. Shichijo, R. Nakane, S. Sugahara, M. Takenaka and N. Sugiyama, IEEE Trans. Electron Devices, Vol. 55 (2008) p.21.

DOI: 10.1109/ted.2007.911034

Google Scholar

[3] D. Kuzum, A. J. Pethe, T. Krishnamohan, Y. Oshima, Y. Sun, J. P. McVittie, P. A. Pianetta, P. C. McIntyre, and K. C. Saraswat, International Electron Device Meeting Tech. Dig., (2007) p.723.

DOI: 10.1109/iedm.2007.4419048

Google Scholar

[4] H. Shang, K. -L. Lee, P. Kozlowski, C. D'Emic, I. Babich, E. Sikorski, M. Ieong, H. -S. P. Wong, K. Guarini, and W. Haensch, IEEE Electron Device Lett., Vol. 25 (2004) p.135.

DOI: 10.1109/led.2003.823060

Google Scholar

[5] S. J. Whang, S. J. Lee, F. Gao, N. Wu, C. X. Zhu, J. S. Pan, L. J. Tang, and D. L. Kwong, International Electron Device Meeting Tech. Dig., (2004) p.307.

Google Scholar

[6] K. Martens, B. D. Jaeger, R. Bonzom, J. V. Steenbergen, M. Meuris, G. Groeseneken, and H. Maes, IEEE Electron Device Lett., Vol. 27 (2006) p.405.

DOI: 10.1109/led.2006.873767

Google Scholar

[7] C. O. Chui, F. Ito, and K. C. Saraswat, IEEE Trans. Electron Devices, Vol. 53 (2006) p.1501.

Google Scholar

[8] S. Takagi, T. Maeda, N. Taoka, M. Nishizawa, Y. Morita, K. Ikeda, Y. Yamashita, M. Nishikawa, H. Kumagai, R. Nakane, S. Sugahara and N. Sugiyama, Microelectron. Eng., Vol. 84, (2007) p.2314.

DOI: 10.1016/j.mee.2007.04.129

Google Scholar

[9] H. Matsubara, T. Sasada, M. Takenaka and S. Takagi, Appl. Phys. Lett., Vol. 93 (2008) 032104.

Google Scholar

[10] T. Sasada, Y. Nakakita, M. Takenaka and S. Takagi, J. Appl. Phys., Vol. 106 (2009) 073716.

Google Scholar

[11] C. H. Lee, T. Tabata, T. Nishimura, K. Nagashio, K. Kita and A. Toriumi, Appl. Phys. Exp., Vol. 2 (2009) 071404.

Google Scholar

[12] S. Takagi, N. Taoka and M. Takenaka, ECS Trans., Vol. 19 (2009) p.67.

Google Scholar

[13] M. Houssa, G. Pourtois, M. Caymax, M. Meuris, M. M. Heyns, V. V. Afanas'ev and A. Stesmans, Appl. Phys. Lett., Vol. 93 (2008) 161909.

DOI: 10.1063/1.3006320

Google Scholar

[14] K. Kita, S. Suzuki, H. Nomura, T. Takahashi, T. Nishimura and A. Toriumi, Jpn. J. Appl. Phys., Vol. 47 (2008) p.2349.

Google Scholar

[15] Y. Nakakita, R. Nakane, T. Sasada, H. Matsubara, M. Takenaka and S. Takagi, International Electron Device Meeting Tech. Dig., (2008) p.877.

Google Scholar

[16] K. Morii, T. Iwasaki, R. Nakane, M. Takenaka and S. Takagi, International Electron Device Meeting Tech. Dig. (2009) p.681.

Google Scholar

[17] K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, IEEE Electron Device Lett., Vol. 31 (2010) p.1092.

Google Scholar

[18] M. Takenaka, M. Sugiyama, Y. Nakano and S. Takagi, European Material Research Society, Symposium I (2009) 14. 4.

Google Scholar

[19] C. H. Lee, T. Nishimura, N. Saido, K. Nagashio, K. Kita and A. Toriumi, I International Electron Device Meeting Tech. Dig. (2009) p.457.

Google Scholar

[20] T. Nishimura, C. H. Lee, S. K. Wang, T. Tabata, K. Kita, K. Nagashio and A. Toriumi, Proc. Symp. on VLSI Tech. (2010) p.209.

Google Scholar

[21] T. Tezuka, N. Sugiyama, T. Mizuno, M. Suzuki, and S. Takagi, Jpn. J. Appl. Phys., Vol. 40 (2001) p.2866.

Google Scholar

[22] S. Nakaharai, T. Tezuka, N. Sugiyama, Y. Moriyama and S. Takagi, Appl. Phys. Lett., Vol. 83 (2003) p.3516.

Google Scholar

[23] S. Nakaharai, T. Tezuka, N. Hirashita, E. Toyoda, Y. Moriyama, N. Sugiyama and S. Takagi, J. Appl. Phys., Vol. 105 (2009) 024515.

DOI: 10.1063/1.3068339

Google Scholar

[24] S. Nakaharai, T. Tezuka, E. Toyoda, N. Hirashita, Y. Moriyama, T. Maeda, T. Numata, N. Sugiyama, and S. Takagi, Ext. Abs. International Conference on Solid State Devices and Materials (2005) p.868.

DOI: 10.7567/ssdm.2005.b-7-3

Google Scholar

[25] K. Ikeda, N. Taoka, Y. Yamashita, M. Harada, K. Suzuki, T. Yamamoto, N. Sugiyama, and S. Takagi, Ext. Abs. International Conference on Solid State Devices and Materials (2007) p.30.

DOI: 10.7567/ssdm.2007.b-1-1

Google Scholar

[26] N. Hirashita, Y. Moriyama, S. Nakaharai, T. Irisawa, N. Sugiyama and S. Takagi, Appl. Phys. Exp., Vol. 1 (2008) 101401.

Google Scholar

[27] S. Takagi, K. Tomiyama, S. Dissanayake and M. Takenaka, presented in ECS Trans. (2010).

Google Scholar

[28] T. Krishnamohan, D. Kim, T. V. Dinh, A. -t. Pham, B. Meinerzhagen, C. Jungemann and K. Saraswat, International Electron Device Meeting Tech. Dig. (2008) 899.

Google Scholar

[29] S. Dissanayake, H. Kumagai, T. Uehara, Y. Shuto, S. Sugahara and S. Takagi, 5th International Conference on SiGe(C) Epitaxy and Heterostructures (2007) p.57.

Google Scholar

[30] S. Dissanayake, Y. Shuto, S. Sugahara, M. Takenaka and S. Takagi, Thin Solid Films, Vol. 517 (2008) p.178.

DOI: 10.1016/j.tsf.2008.08.102

Google Scholar

[31] S. Dissanayake, S. Sugahara, M. Takenaka and S. Takagi, Appl. Phys. Exp., Vol. 3 (2010) 041302.

Google Scholar

[32] S. Takagi, Proc. Symp. on VLSI Tech. (2003) p.115.

Google Scholar

[33] S. Takagi, Ext. Abs. International Conference on Solid State Devices and Materials (2004) p.10.

Google Scholar