• Registration Log In
  • For Libraries
  • For Publication
  • Open Access
  • Downloads
  • About Us
  • Contact Us
For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Preface
Models for Impurity Incorporation during Vapor-Phase Epitaxy
p.3
Liquid Si-Induced 4H-SiC Surface Structuring Using a Sandwich Configuration
p.8
Defect Reduction in Epilayers for SiC Trench MOSFETs by Enhanced Epitaxial Growth
p.13
High Temperature Etching for Threading Dislocation Investigation on GaN Epi-Layer
p.18
3C-SiC Heteroepitaxial Layers Grown on Silicon Substrates with Various Orientations
p.23
A Novel Approach of Utilizing Mechanically Flexible SiC Substrate to Grow Crack-Free AlN Bulk Crystal by Thermal Strain Relaxation Functionality
p.28
The Impact of Defect Density on Mechanical Characteristics of 4H-SiC Substrates
p.33
Aluminum Activation in 4H-SiC Measured on Laterally Contacted MOS Capacitors with a Buried Current-Spreading Layer
p.38
HomeMaterials Science ForumMaterials Science Forum Vol. 1062Preface

Preface

Article Preview
Article Preview
Article Preview

Abstract:

By email View Pdf
You have full access to the following eBook
Silicon Carbide and Related Materials 2021 Read eBook

Info:

Periodical:

Materials Science Forum (Volume 1062)

Online since:

May 2022

Permissions:

Creative Commons CC BY 4.0

Share:

Related Articles
Citation
Add To Cart

Paper price:

After payment, you will receive an email with instructions and a link to download the purchased paper.

You may also check the possible access via personal account by logging in or/and check access through your institution.

Back
Add To Cart

This paper has been added to your cart

Back To Cart
  • For Libraries
  • For Publication
  • Insights
  • Downloads
  • About Us
  • Policy & Ethics
  • Contact Us
  • Imprint
  • Privacy Policy
  • Sitemap
  • All Conferences
  • All Special Issues
  • All News
  • Open Access Partners

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.