Behavior of Shockley-Type Stacking Faults in SiC Superjunction MOSFET under Body Diode Current Stress

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Abstract:

We evaluated stacking faults expanding by body diode current stress in the SiC Semi-SJ MOSFET for the first time. It was found that body diode degradation of the SJ MOSFETs tends to be smaller than that of conventional Non-SJ MOSFETs. Detailed crystal evaluations revealed that the stacking faults did not expand into the SJ structure. It is assumed that the expansion stops due to low carrier densities. The result suggests that the SJ device has a high potential as a device for suppressing the body diode degradation.

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[1] S. Harada, Y. Kobayashi, S. Kyogoku, T. Morimoto, T. Tanaka, M. Takei and H. Okumura, First Demonstration of Dynamic Characteristics for SiC Superjunction MOSFET Realized using Multiepitaxial Growth Method, 2018 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, p.8.2.1-8.2.4, (2018).

DOI: 10.1109/iedm.2018.8614670

Google Scholar

[2] M. Baba, T. Tawara, T. Morimoto, S. Harada, M. Takei and H. Kimura, Ultra-Low Specific on-Resistance Achieved in 3.3 kV-Class SiC Superjunction MOSFET, 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD), pp.83-86, (2021).

DOI: 10.23919/ispsd50666.2021.9452273

Google Scholar

[3] T. Masuda, Y. Saito, T. Kumazawa, T. Hatayama and S. Harada, 0.63mΩcm2 / 1170 V 4H-SiC Super Junction V-Groove Trench MOSFET, 2018 IEEE International Electron Devices Meeting (IEDM), p.8.1.1-8.1.4, (2018).

DOI: 10.1109/iedm.2018.8614610

Google Scholar

[4] K. Konishi, S. Yamamoto, S. Nakata, Y. Nakamura, Y. Nakanishi, T. Tanaka, Y. Mitani, N. Tomita, Y. Toyoda and S. Yamakawa, Stacking fault expansion from basal plane dislocations converted into threading edge dislocations in 4H-SiC epilayers under high current stress, Journal of Applied Physics 114, 014504, (2013).

DOI: 10.1063/1.4812590

Google Scholar

[5] A. Agarwal, H. Fatima, S. Haney and S. Ryu, A New Degradation Mechanism in High-Voltage SiC Power MOSFETs, IEEE Electron Device Letters, 28, 7, pp.587-589, (2007).

DOI: 10.1109/led.2007.897861

Google Scholar

[6] T. Tanaka, N. Kawabata, Y. Mitani, N. Tomita, M. Tarutani, T. Kuroiwa, Y. Toyoda, M. Imaizumi, H. Sumitani and S. Yamakawa, Demonstration of High Quality 4H-SiC Epitaxial Growth with Extremely Low Basal Plane Dislocation Density, Materials Science Forum, 778-780, pp.91-94, (2014).

DOI: 10.4028/www.scientific.net/msf.778-780.91

Google Scholar

[7] T. Fukui, T. Tawara and M. Kato, Effects of the ion implantation process on carrier lifetimes in 4H-SiC SJ-MOSFET, 2021 International Conference on Solid State Devices and Materials (SSDM), online, D-4-07, (2021).

Google Scholar

[8] A. Iijima and T. Kimoto, Theoretical and experimental investigation of critical condition for expansion/contraction of a single Shockley stacking fault in 4H-SiC, Europ. Conf. on Silicon Carbide and Related Materials (ECSCRM), Birmingham, UK, MO.04.02, (2018).

DOI: 10.1063/1.5143690

Google Scholar

[9] T. Tawara, S. Matsunaga, T. Fujimoto, M. Ryo, M. Miyazato, T. Miyazawa, K. Takenaka, M. Miyajima, A. Otsuki, Y. Yonezawa, T. Kato, H. Okumura, T. Kimoto and H. Tsuchida, Injected carrier concentration dependence of the expansion of single Shockley-type stacking faults in 4H-SiC PiN diodes, Journal of Applied Physics 123, 025707, (2018).

DOI: 10.1063/1.5009365

Google Scholar