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On the Frequency Dependence of the Gate Switching Instability in Silicon Carbide MOSFETs

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Abstract:

Silicon carbide power metal-oxide semiconductor field-effect transistors (MOSFETs) are suitable for more compact and energy efficient electric power conversion, pushing forward numerous key technologies in emission-free mobility and green power generation. These applications require fast gate switching up to hundreds of kilohertz. Typically, to assure a clear turn-off state of the electron channel, a negative turn-off gate bias is used in conjunction with a positive turn-on gate bias. Recently, several reports have revealed a new and so far unknown degradation mechanism that emerges during such operation conditions in apparently all commercial silicon carbide MOSFETs. As this mechanism arises upon gate switching, the terms gate switching instability (GSI) and gate switching stress (GSS) for the mechanism and the associated stress, respectively, have been introduced.Here, we show that this degradation mechanism does not depend on the used frequency up to at least 2 MHz, but that it is actually related to the cumulative number of switching cycles. For this purpose, we performed measurements at various frequencies comprising ultra-fast in-situ measurements of the threshold voltage and pre- and post-stress characterization by impedance analysis. The results are important both for understanding the underlying physics and for developing a correct methodology for industrial device qualification.

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Periodical:

Materials Science Forum (Volume 1092)

Pages:

109-117

DOI:

https://doi.org/10.4028/p-6g5v7s

Citation:

Cite this paper

Online since:

June 2023

Authors:

Maximilian Wolfgang Feil*, Katja Waschneck, Hans Reisinger, Paul Salmen, Gerald Rescher, Thomas Aichinger, Wolfgang Gustin, Tibor Grasser

Keywords:

Bias Temperature Instability (BTI), Gate Switching Instability, Gate Switching Stress

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Creative Commons CC BY 4.0

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* - Corresponding Author

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