Preface
Comparative Study on Grinding Behavior of C-Face and Si-Face in Laser-Sliced 4H-SiC Wafers
p.1
p.1
Effects of Processing Passes on Laser-Sliced SiC
p.9
p.9
Feasibility Study of SiC Wafer Reutilization Process through Laser Splitting and Bonding Techniques
p.19
p.19
Impacts of Wafer Thinning Process Using Laser Slice Technique on Silicon Carbide Device Characteristics
p.25
p.25
A Study on the Synthesis and Evaluation of Si/SiC Powders for SiC Wafers Fabrication and Si-Based Devices
p.33
p.33
Damage-Free Dicing of SiC Substrate Using High-Pressure SF6 Plasma: The Time Dependence of Processed Groove Profiles
p.41
p.41
Correlation Study of Physical and Optical Total Thickness Variation in 4H-SiC Substrates
p.47
p.47
Impact of Ambient Conditions on Oxide Thickness Distribution on 4H-SiC in Thermal Oxidation Furnace
p.55
p.55
Preface
Abstract:
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