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Comparative Study on Grinding Behavior of C-Face and Si-Face in Laser-Sliced 4H-SiC Wafers
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Effects of Processing Passes on Laser-Sliced SiC
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Damage-Free Dicing of SiC Substrate Using High-Pressure SF6 Plasma: The Time Dependence of Processed Groove Profiles
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Correlation Study of Physical and Optical Total Thickness Variation in 4H-SiC Substrates
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Impact of Ambient Conditions on Oxide Thickness Distribution on 4H-SiC in Thermal Oxidation Furnace
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HomeMaterials Science ForumMaterials Science Forum Vol. 1193Effects of Processing Passes on Laser-Sliced SiC

Effects of Processing Passes on Laser-Sliced SiC

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Abstract:

Silicon carbide (SiC), a representative of next-generation wide-bandgap semiconductors, exhibits enormous application potential in fields such as new energy vehicles, aerospace, and photovoltaic power generation. Conventional cutting methods based on diamond wire sawing suffer from high material loss and are prone to causing fractures. In contrast, laser slicing, as a kerf-free processing technology, enables the acquisition of high-quality wafers with minimal material removal. This study systematically investigates the effect of processing cycles on crack propagation and delamination strength during laser slicing of SiC. The experimental results demonstrate that under optimized parameters, an appropriate number of processing cycles can achieve successful wafer separation while maintaining surface integrity, reducing material loss, and lowering delamination strength. The established processing window provides practical guidance for improving SiC slicing quality and holds significant implications for advancing innovative wafer manufacturing technologies in power electronics applications.

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Wafer Processing

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Periodical:

Materials Science Forum (Volume 1193)

Pages:

9-17

DOI:

https://doi.org/10.4028/p-OGH9rS

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Online since:

May 2026

Authors:

Jian Fei Zhang*, Bi Xue Li, Qiu Chen, Lin Lin Che, Xing Zhang, Hao Yu Fan, Yang Yang Jia, Jia Wei Wang, Yu Feng Xue, Rong Kun Wang, Xiu Fang Chen

Keywords:

Crack Propagation, Kerf Loss, Laser Slicing

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* - Corresponding Author

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