Mechanism for Damage Healing of Cracked 6H-SiC Substrates by the Sublimation Method

Abstract:

Article Preview

Info:

Periodical:

Materials Science Forum (Volumes 353-356)

Edited by:

G. Pensl, D. Stephani and M. Hundhausen

Pages:

77-80

Citation:

T. Shimizu et al., "Mechanism for Damage Healing of Cracked 6H-SiC Substrates by the Sublimation Method", Materials Science Forum, Vols. 353-356, pp. 77-80, 2001

Online since:

January 2001

Export:

Price:

$38.00

Fetching data from Crossref.
This may take some time to load.