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HomeMaterials Science ForumMaterials Science Forum Vols. 457-460Improvement of SiC Wafer Warp by Annealing

Improvement of SiC Wafer Warp by Annealing

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Silicon Carbide and Related Materials 2003

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Periodical:

Materials Science Forum (Volumes 457-460)

Pages:

829-832

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.457-460.829

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Online since:

June 2004

Authors:

Makato Sasaki, Shinsuke Harada, Yoshihiro Okamoto, Hideo Kinoshita, Youichi Miyanagi, Hiromu Shiomi

Keywords:

Annealing, Basal Plane Dislocation (BPD), Wafer Warp

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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