Hall Effect in the Channel of 3C-SiC MOSFETs

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Abstract:

Temperature-dependent Hall effect investigations in the channel of lateral 3C-SiC LDDMOSFETs with nitrogen(N)-implanted source/drain regions are conducted. The free electron concentration and the electron Hall mobility are independently determined. A maximum electron Hall mobility of 75 cm2/Vs is observed. The gate oxide withstands electric field strengths up to 5 MV/cm. A high density of interface states of a few 1013 cm-2eV-1 close to the 3C-SiC conduction band edge still lowers the performance of the MOS device.

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Materials Science Forum (Volumes 483-485)

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441-444

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May 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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