Characterisation of 4H-SiC PiN Diodes by Micro-Raman Scattering and Photoemission

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Abstract:

Structural defects in SiC crystals were investigated and 4H-SiC pin devices were characterized by micro-Raman scattering and photoemission. With the experimental set-up presented, defects could be successfully detected in SiC crystals but stacking faults could not be detected with micro-Raman scattering, although they could be detected by photoemission. Residual stress could be evaluated in 4H-SiC devices, as well as the temperature increase associated with the devices powering. A good correlation was found between the characterization techniques used: micro-Raman scattering and photoemission.

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Materials Science Forum (Volumes 483-485)

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437-440

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May 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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