Advanced Welding and Micro Joining / Packaging for the 21st Century

Volumes 580-582

doi: 10.4028/www.scientific.net/MSF.580-582

Paper Title Page

Authors: Sung Hwan Hwang, Jung Woon Lim, Hyo Hoon Park, Myung Yong Jeong, Byung Sup Rho

Abstract: An optical subassembly which is suitable for high speed and parallel optical modules was introduced. The optical subassembly has features...

159
Authors: Seung Hun Oh, Chang Seok Kim, Byung Sup Rho, Seung Boo Jung, Myung Yong Jeong

Abstract: In an optical module with high density and small size, it is important to maintain the operating temperature by adequate heat dissipation....

163
Authors: Hong Bo Xu, Ming Yu Li, Jong Myung Kim, Hong Bae Kim, Dae Won Kim

Abstract: The focus of this study was on discussing the novel reflow method ISHR (Induction spontaneous heat reflow) used for high-density area array...

167
Authors: Hee Seon Bang, Hong Jun Ji, Ming Yu Li, Chun Qing Wang, Han Sur Bang

Abstract: In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was...

173
Authors: K.I. Kang, J.P. Jung, Woong Ho Bang, J.H. Park, Kyu Hwan Oh

Abstract: Bending fatigue behavior of eutectic Sn-3.5Ag solder bump bonded on FR4-PCB was characterized by experimental and finite element method...

177
Authors: Oh Sung Song, Jong Ryul Kim, Myung Ro Kim

Abstract: Granulation is a precious metal craft process method that decorates a metal surface using tiny metal granules. It was imported into Korea...

183
Authors: Jeng O Kim, Jae Pil Jung, Jae Hoon Lee, Jeong Suh, Hee Shin Kang

Abstract: Pulsed Nd;YAG laser was applied to investigate the bond characteristics of Sn- 3.5wt%Ag (hereafter, Sn-3.5Ag) solder ball. The ball...

191
Authors: Sung J. Lee, Sei Young Moon, Se. W. Jung, Seung Soo Han, Sang Jeen Hong

Abstract: To alleviate concerns of manufacturing cost and efficiency of solar cell fabrication, a belt type-high temperature furnace with three...

197
Authors: J. Lee, Michael Mayer, Y. Zhou, S.J. Hong, S.M. Lee

Abstract: Tail breaking forces (TBFs) are measured for various process conditions to understand phenomena such as short tail formation. TBFs obtained...

201
Authors: Tadashi Takemoto

Abstract: Sn-based lead-free solders have some characteristics that are different from the conventionally used Sn-Pb eutectic. One is the high...

205

Showing 41 to 50 of 166 Paper Titles