High Voltage 4H-SiC BJTs with Deep Mesa Edge Termination

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Abstract:

This paper reports our recent study on 4H-SiC power bipolar junction transistors (BJTs) with deep mesa edge termination. 1200 V – 10 A 4H-SiC power BJTs with an active area of 4.64 mm2 have been demonstrated using deep mesa for direct edge termination and device isolation. The BJT’s DC current gain () is about 37, and the specific on-resistance (RSP-ON) is ~ 3.0 m-cm2. The BJT fabrication is substantially simplified and an overall 10% reduction in the device area is achieved compared to the multi-step JTE-based SiC-BJTs.

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Materials Science Forum (Volumes 679-680)

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710-713

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March 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] D. Planson, M.L. Locatelli, S. Ortolland, J.P. Chante, H. Mitlehner, D. Stephani: Materials Science & Engineering, B46 (1997), p.210.

DOI: 10.1016/s0921-5107(96)01983-6

Google Scholar

[2] Q. Zhang, and A. Agarwal: Phys. Status Solidi A206 (2009), p.2431.

Google Scholar

[3] X. Li, K. Tone, L. Fursin, J.H. Zhao, T. Turke, P. Alexandrov, M. Pan and M. Weiner: Electronics Letters, Vol. 37 (2001), p.392.

Google Scholar

[4] J. Zhang, X. Li, P. Alexandrov, L. Fursin, X. Wang and J.H. Zhao: IEEE Tran. On Elec. Dev. Vol. 55 (2008), p.1899.

Google Scholar

[5] O. Kordina, J.P. Bergman, A. Henry, E. Janzen, S. Savage, J. Andre, L.P. Ramberg, U. Lindefelt, W. Hermansson, and K. Bergman: Appl. Phys. Lett. 67 (1995), p.1561.

DOI: 10.1063/1.114734

Google Scholar

[6] C. Park; J. Kim; T. Kim; D.J. Kim: Power Semi. Dev. & Ics (2003), p.199.

Google Scholar

[7] T. Hiyoshi, T. Hori, J. Suda, and T. Kimoto: IEEE Tran. Elec. Dev. Vol. 55 (2008), p.1841.

Google Scholar